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Lead-Free Solder Interconnect Reliability
Name: Lead-Free Solder Interconnect Reliability
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15 Feb On Jan 1, Dongkai Shangguan published: Lead-Free Solder Interconnect Reliability. Abstract—Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with . This paper discusses reliability issues related to lead-free printed circuit board interconnects. A comprehensive review of the published literature was ca.
Lead-Free Solder Interconnect Reliability. Front Cover. Dongkai Shangguan. ASM International, - Technology & Engineering - pages. My library · Help · Advanced Book Search · Buy eBook - $ Get this book in print Lead-Free Solder Interconnect Reliability. edited by Dongkai Shangguan . 15 Mar Reliability of Lead‐Free Electronic Solder Interconnects: Roles of Material and Phase Diagrams and Their Applications in Pb‐Free Soldering.
15 Mar Chapter 1. Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters (pages 1–9). K. N. Subramanian. Library of Congress Cataloging-in-Publication Data. Lead-free solder interconnect reliability / edited by Dongkai Shangguan. p. cm. Includes bibliographical. Fundamentals of Lead-Free Solder Interconnect Technology. From Microstructures to Reliability. Authors: Lee, T.-K., Bieler, Th.R., Kim, C.-U., Ma, H. Provides an. Lead-Free Solder Interconnect Reliability. Dongkai ShangguanASM International PublicationApproximately pagesScheduled to publish Summer/Fall. This paper will describe tests of the interconnect reliability of BGA components with tin‐lead bumps soldered with lead‐free solder paste during temperature.
Lead-free Solder Interconnect Reliability. Front Cover. Dongkai Shangguan. ASM International, Jan 1, - Technology & Engineering - pages. 27 Nov reliability advancement of lead-free solder interconnects is still Solder interconnect reliability involves the integration of applied sciences. 28 Oct Available in: Hardcover. After overviewing the materials and processing of lead- free soldering, this collection presents the latest research on. Solder Interconnect Reliability • Solder paste deposition • Component placement • Fluxing Lead-Free Solder Interconnect Reliability The reliability of the.